Boyd Laconia, LLC 半导体芯片产品线

共收录 1,605 款器件技术手册
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共收录 1,605 款 Boyd Laconia, LLC 官方器件手册 (第 11 页)
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器件型号 (MPN) 制造原厂 封装规格 电气特性与技术摘要 规格书 / 详情
Boyd Laconia, LLC 标准封装 HEAT PIPE FLAT 2.8X8X150MM
Boyd Laconia, LLC 标准封装 HEAT PIPE FLAT 3.5X6X100MM
Boyd Laconia, LLC 标准封装 THERM PAD 400X200MM W/ADH GRAY
Boyd Laconia, LLC 标准封装 THERM PAD 130MMX130MM BLACK
56-03-8G PDF
Boyd Laconia, LLC 标准封装 THERM PAD 42.85X30.15MM OPAQUE
43-77-9G PDF
Boyd Laconia, LLC 标准封装 THERM PAD 18.42MMX13.21MM AMBER
PAAD18020BT PDF
Boyd Laconia, LLC 标准封装 FAN 12VDC 80X20MM
PSAD18010BL PDF
Boyd Laconia, LLC 标准封装 FAN 12VDC 80X10.6MM PWM/TACH
V708-75/2-216 PDF
Boyd Laconia, LLC 标准封装 O-RING FLUOROCARBON BROWN -216
7717-131DAPG PDF
Boyd Laconia, LLC 标准封装 HEATSINK
Boyd Laconia, LLC 标准封装 THM,7717-43DAP REV I
7717-149N PDF
Boyd Laconia, LLC 标准封装 MOUNT CIRCULAR TO-18 0.120"
7717-4DAPG PDF
Boyd Laconia, LLC 标准封装 MOUNT CIRCULAR TO-5 0.075"
7717-161DAPG PDF
Boyd Laconia, LLC 标准封装 MOUNT CIRCULAR TO-5 0.075"
7717-21NG PDF
Boyd Laconia, LLC 标准封装 MOUNT CIRCULAR GEN PURP 0.275"
8191-E40 PDF
Boyd Laconia, LLC 标准封装 MOUNT RECTANGULAR TO220
Boyd Laconia, LLC 标准封装 THM,7717-8DAP REV C-G
7717-131DAP PDF
Boyd Laconia, LLC 标准封装 MOUNT CIRCULAR TO-5 0.038"
7717-153N PDF
Boyd Laconia, LLC 标准封装 MOUNT CIRCULAR TO-18 0.038"
17150010 REV B PDF
Boyd Laconia, LLC 标准封装 17150010 REV B
8114LB603 PDF
Boyd Laconia, LLC 标准封装 THM,11692 REV J
43-03-3G PDF
Boyd Laconia, LLC 标准封装 PAD,KP,200HN,1.063X1.655,MOD
NX302101 PDF
Boyd Laconia, LLC 标准封装 SQUARE HEAT SINK L100-90 CONFIG
115600F00000G PDF
Boyd Laconia, LLC 标准封装 HEATSINK
342942 PDF
Boyd Laconia, LLC 标准封装 COPPER HEATSINK 45X44X22.5MM
780701F00000G PDF
Boyd Laconia, LLC 标准封装 EXTR,78070-8.2FT(98.4")
335314B00000G PDF
Boyd Laconia, LLC 标准封装 HEAT SINK
572802B04000G PDF
Boyd Laconia, LLC 标准封装 572802B04000G
ES0714G23-F9 PDF
Boyd Laconia, LLC 标准封装 HEAT EXCHANGER
Boyd Laconia, LLC 标准封装 342948,REV03(GP)
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