Boyd Laconia, LLC 半导体芯片产品线

共收录 1,605 款器件技术手册
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共收录 1,605 款 Boyd Laconia, LLC 官方器件手册 (第 15 页)
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器件型号 (MPN) 制造原厂 封装规格 电气特性与技术摘要 规格书 / 详情
E300-70/2-211 PDF
Boyd Laconia, LLC 标准封装 O-RING EPDM BLACK -211
S500-70/2-211 PDF
Boyd Laconia, LLC 标准封装 O-RING SILICONE RED -211
V708-75/2-009 PDF
Boyd Laconia, LLC 标准封装 O-RING FLUOROCARBON BROWN -9
N100-70/2-325 PDF
Boyd Laconia, LLC 标准封装 O-RING BUNA-N BLACK -325
N100-70/2-217 PDF
Boyd Laconia, LLC 标准封装 O-RING BUNA-N BLACK -217
E300-70/2-011 PDF
Boyd Laconia, LLC 标准封装 O-RING EPDM BLACK -11
S500-70/2-007 PDF
Boyd Laconia, LLC 标准封装 O-RING SILICONE RED -7
N100-70/2-110 PDF
Boyd Laconia, LLC 标准封装 O-RING BUNA-N BLACK -110
S500-70/2-214 PDF
Boyd Laconia, LLC 标准封装 O-RING SILICONE RED -214
7721-3PPSG PDF
Boyd Laconia, LLC 标准封装 WASHER SHOULDER POLY SULFIDE
6110G1SB-D9 PDF
Boyd Laconia, LLC 标准封装 HEAT EXCHANGER
Boyd Laconia, LLC 标准封装 KODIAK CHILLER 5900W
ES0510G23 PDF
Boyd Laconia, LLC 标准封装 HEAT EXCHANGER
782203B09000G PDF
Boyd Laconia, LLC 标准封装 HEATSINK EXTRUSION
574502B03200G PDF
Boyd Laconia, LLC 标准封装 HEATSINK TO-220 CLIP-ON/TAB
654452F00000G PDF
Boyd Laconia, LLC 标准封装 65445 EXTRUSION 1.312X7.34"X4'
552703B00000 PDF
Boyd Laconia, LLC 标准封装 BOARD LEVEL HEAT SINK
591302B04000G PDF
Boyd Laconia, LLC 标准封装 BOARD LEVEL HEAT SINK
374724B60024G PDF
Boyd Laconia, LLC 标准封装 HEATSINK BGA W/O SOLDER ANCHORS
573902B00000G PDF
Boyd Laconia, LLC 标准封装 HEATSINK TO-220 BLACK CLIP-ON
780102F00000G PDF
Boyd Laconia, LLC 标准封装 78010 EXTRUSION 2.95X1.34"X4.1'
631352F00000G PDF
Boyd Laconia, LLC 标准封装 63135 EXTRUSION 1.75X2.125"X4'
326005B00000G PDF
Boyd Laconia, LLC 标准封装 HEATSINK TO-5 1W H=.375" BLK
507102B00000G PDF
Boyd Laconia, LLC 标准封装 HEATSINK TO-220 EXT CAP 2W
580200B00000G PDF
Boyd Laconia, LLC 标准封装 HEATSINK 14-16 DIP BLK ANODIZED
591202B00000G PDF
Boyd Laconia, LLC 标准封装 HEATSINK TO-220 VERT/HORZ MOUNT
575703B00000G PDF
Boyd Laconia, LLC 标准封装 BOARD LEVEL HEAT SINK
7128DG PDF
Boyd Laconia, LLC 标准封装 BOARD LEVEL HEATSINK .375"TO-220
573400D00010G PDF
Boyd Laconia, LLC 标准封装 HEATSINK D-PAK3 TIN PLATED SMD
501503B00000G PDF
Boyd Laconia, LLC 标准封装 HEATSINK TO-3 1.00" BLK
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