Boyd Laconia, LLC 半导体芯片产品线

共收录 1,605 款器件技术手册
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共收录 1,605 款 Boyd Laconia, LLC 官方器件手册 (第 14 页)
✓ 原厂原版 PDF
器件型号 (MPN) 制造原厂 封装规格 电气特性与技术摘要 规格书 / 详情
CLP-204 PDF
Boyd Laconia, LLC 标准封装 CLIP
PF18G PDF
Boyd Laconia, LLC 标准封装 PF18G
BW38-2G PDF
Boyd Laconia, LLC 标准封装 HTSK-AL-000BW-38-B-PINS-(D)-(ROH
BW63-2G PDF
Boyd Laconia, LLC 标准封装 BW63-2G
CLP-203G PDF
Boyd Laconia, LLC 标准封装 CLIP
116600F00000 PDF
Boyd Laconia, LLC 标准封装 CLIP
189754F00000G PDF
Boyd Laconia, LLC 标准封装 PAD,97,0.500X00.750,W/.147HOLE
Boyd Laconia, LLC 标准封装 HEAT PIPE ROUND 8 OD 360MM
Boyd Laconia, LLC 标准封装 THERM PAD 400X200MM W/ADH BLACK
5300 6.000 PDF
Boyd Laconia, LLC 标准封装 THERM PAD 152.4MX100MM GRAY/GRN
Boyd Laconia, LLC 标准封装 THERM PAD 140MMX140MM BLACK
4004-1 PDF
Boyd Laconia, LLC 标准封装 4004-1,REV A(GP)
189858F00000G PDF
Boyd Laconia, LLC 标准封装 THERM PAD W/ADH GRAY
Boyd Laconia, LLC 标准封装 THERM PAD 76.2X76.2MM W/ADH
43-66-1G PDF
Boyd Laconia, LLC 标准封装 PAD,KP,200HN,0.762X1.312,MOD1G
5300 6.000G PDF
Boyd Laconia, LLC 标准封装 THERM PAD 152.40M X100MM GRY/GRN
189958F00000 PDF
Boyd Laconia, LLC 标准封装 THERM PAD 19.05MMX12.7MM W/ADH
56-77-10 PDF
Boyd Laconia, LLC 标准封装 THERM PAD 21.89MMX13.21MM OPAQUE
Boyd Laconia, LLC 标准封装 THERM PAD 76.2X76.2MM W/ADH GRAY
189805F00000 PDF
Boyd Laconia, LLC 标准封装 THERM PAD 41.91X28.96MM W/ADH
Boyd Laconia, LLC 标准封装 THERM PAD 76.2X76.2MM W/ADH
4720A PDF
Boyd Laconia, LLC 标准封装 HARD ANODIZED ALUMINUM INSULATOR
Boyd Laconia, LLC 标准封装 THERM PAD 76.2X76.2MM W/ADH GRAY
Boyd Laconia, LLC 标准封装 PEAD4A238BH MF00 YHHB-01
Boyd Laconia, LLC 标准封装 PEAD28025BM PF00
Boyd Laconia, LLC 标准封装 PEAD18038BH MF00
Boyd Laconia, LLC 标准封装 PSAD4A238BM PF00
N100-70/2-215 PDF
Boyd Laconia, LLC 标准封装 O-RING BUNA-N BLACK -215
V708-75/2-222 PDF
Boyd Laconia, LLC 标准封装 O-RING FLUOROCARBON BROWN -222
E300-70/2-112 PDF
Boyd Laconia, LLC 标准封装 O-RING EPDM BLACK -112
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