OSCILLATOR MEMS SMD
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| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
| Microchip Technology |
标准封装
|
OSCILLATOR MEMS SMD | ||
| Microchip Technology |
标准封装
|
OSCILLATOR MEMS SMD | ||
| Microchip Technology |
标准封装
|
OSCILLATOR MEMS SMD | ||
| Microchip Technology |
标准封装
|
OSCILLATOR MEMS SMD | ||
| Microchip Technology |
标准封装
|
OSCILLATOR MEMS SMD | ||
| Microchip Technology |
标准封装
|
OSCILLATOR MEMS SMD | ||
| Texas Instruments |
标准封装
|
LOW-POWER, LOW-JITTER, BULK-ACOU | ||
| Texas Instruments |
标准封装
|
LOW-JITTER, HIGH-PERFORMANCE, BU | ||
| SiTime |
标准封装
|
MEMS OSC XO 2.0007MHZ HCMOS | ||
| EPSON |
标准封装
|
XTAL OSC XO 4.754687MHZ CMOS SMD | ||
| EPSON |
标准封装
|
XTAL OSC TCXO 49.5800MHZ SMD | ||
| EPSON |
标准封装
|
XTAL OSC XO 20.000000MHZ SMD | ||
| EPSON |
标准封装
|
XTAL OSC XO 26.2144MHZ CMOS SMD | ||
| EPSON |
标准封装
|
XTAL OSC XO 32.000000MHZ SMD | ||
| EPSON |
标准封装
|
XTAL OSC XO 120.000MHZ CMOS SMD | ||
|
8R-19.200MDD-T
PDF
|
TXC CORPORATION |
标准封装
|
1.6X1.2 CMOS QUARTZ OSCILLATOR / | |
| Microchip Technology |
标准封装
|
OSCILLATOR MEMS SMD | ||
| Microchip Technology |
标准封装
|
MEMS CMOS OSC | ||
| Microchip Technology |
标准封装
|
MEMS CMOS OSC | ||
|
12.95338
PDF
|
Geyer Electronic America, Inc. |
标准封装
|
CLOCK, OSCILLATOR, CERAMIC SMD 4 | |
| Microchip Technology |
标准封装
|
MEMS OSC XO 1.0486MHZ CMOS SMD | ||
| EPSON |
标准封装
|
XTAL OSC XO 11.4000MHZ CMOS SMD | ||
| EPSON |
标准封装
|
OSC XO BLANK SMD | ||
| EPSON |
标准封装
|
XTAL OSC XO 33.554432MHZ CMOS SM | ||
| EPSON |
标准封装
|
XTAL OSC TCXO 40.0000MHZ SMD | ||
| EPSON |
标准封装
|
XTAL OSC TCXO 40.0000MHZ SMD | ||
| Microchip Technology |
标准封装
|
OSCILLATOR MEMS SMD | ||
| Microchip Technology |
标准封装
|
OSCILLATOR MEMS SMD | ||
| Microchip Technology |
标准封装
|
MEMS CMOS OSC | ||
| Microchip Technology |
标准封装
|
MEMS CMOS OSC |
