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粘合剂，环氧树脂，油脂，膏 芯片选型指南与应用电路参考
本专区收录了 628 款主流 粘合剂，环氧树脂，油脂，膏 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图（Pinout）、工作温度范围等电气参数，支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
|
2167111
PDF
|
Bergquist |
标准封装
|
TGF 1000SR 50CC DUAL CARTRIDGE | |
|
2407887
PDF
|
Bergquist |
标准封装
|
TGF 1400SL 7 GALLON KIT | |
|
2190224
PDF
|
Bergquist |
标准封装
|
TBP 400P 12"X250' ROLL | |
|
8616-16G
PDF
|
MG Chemicals |
标准封装
|
PREMIUM THERMAL PASTE, 3 W/M.K | |
|
TG-A7000-1000
PDF
|
t-Global Technology |
标准封装
|
SILICONE PUTTY 1KG POT GREEN | |
|
E150630C
PDF
|
ELBA LUBES |
标准封装
|
NON- SILICONE HEAT SINK COMPOUND | |
|
SH-PUTTY3-100
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
THERMAL PUTTY 100G, GRAY COLOR, | |
|
S-PUTTY2-985
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
THERMAL PUTTY 985G, BLUE COLOR, | |
|
TH930-75cc-syr
PDF
|
Penchem Technologies Sdn Bhd |
标准封装
|
Silicone Thermal Putty | |
|
GCS-040-GNS-1KG
PDF
|
European Thermodynamics Ltd |
标准封装
|
NON SILICONE GREASE,4W/M K, 1KG | |
|
TH930-50G-4JAR
PDF
|
Penchem Technologies Sdn Bhd |
标准封装
|
SILICONE THERMAL PUTTY (4 PACKS) | |
|
H-PUTTY2-100
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
THERMAL PUTTY 100G, BLUE COLOR, | |
| Coolmag TC |
标准封装
|
2K Pack : 1kg Resin+1kg Hardene | ||
|
TC2-50G
PDF
|
Chip Quik Inc. |
标准封装
|
HEAT SINK COMPOUND - GREY ULTRA | |
|
DP-100-30
PDF
|
Taica North America Corporation |
标准封装
|
THERMAL PASTE, 30CC SYRINGE | |
|
1188135
PDF
|
LOCTITE |
标准封装
|
STYCAST 2850KT BLU 20# | |
|
NL-PUTTY10-90
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
NON-SILICONE LIGHTWEIGHT THMERMA | |
|
G3380D-100
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
THERMAL GREASE, 100G, DUAL CARTR | |
|
TG-N909-30
PDF
|
t-Global Technology |
标准封装
|
NON-SILICONE THERMAL GREASE 30G | |
|
65-00-GEL37-0010
PDF
|
Parker Chomerics |
标准封装
|
THERM-A-GAP GEL 37 3.7 W/M-K DIS | |
| Parker Chomerics |
标准封装
|
THERM-A-GAP GEL50TBL 5.0W/MK10CC | ||
|
DM-TIM-15323-P
PDF
|
Dycotec Materials Ltd |
标准封装
|
ONE PART THERMAL EPOXY 2.3 W/MK | |
|
8329TFS-25ML
PDF
|
MG Chemicals |
标准封装
|
SLOW CURE THERM COND ADH FLOW | |
|
TC4-20G
PDF
|
Chip Quik Inc. |
标准封装
|
HEAT SINK THERMAL COMPOUND - DEE | |
| Parker Chomerics |
标准封装
|
THERM-A-GAP GEL 60HF 6.2 W/M-K D | ||
|
8327GF25-50CC
PDF
|
MG Chemicals |
标准封装
|
THERMAL GAP FILL LIQUID SILICONE | |
|
152-1B-NC
PDF
|
Wakefield-Vette |
标准封装
|
DELTABOND BIPACK (1 OZ W B TYPE | |
|
ACTCP00002B
PDF
|
ARCTIC |
标准封装
|
Cooler Zubehoer Waermeleitpaste | |
|
A17250-03
PDF
|
Laird Technologies - Thermal Materials |
标准封装
|
TPUTTY 607 14KG,1GAL PAIL | |
|
A18000-05
PDF
|
Laird Technologies - Thermal Materials |
标准封装
|
TFLEX CR350 26KG,1GAL PAIL KIT |
