重点方案领域直达:
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粘合剂,环氧树脂,油脂,膏 芯片选型指南与应用电路参考
本专区收录了 628 款主流 粘合剂,环氧树脂,油脂,膏 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图(Pinout)、工作温度范围等电气参数,支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
|
2166234
PDF
|
Bergquist |
标准封装
|
TGF 2000 400CC DUAL CARTRIDGE | |
|
2191894
PDF
|
Bergquist |
标准封装
|
TGF 1500LVO 1200CC KIT | |
|
2167388
PDF
|
Bergquist |
标准封装
|
TLB SA3500 50CC DUAL CARTRIDGE | |
|
2166563
PDF
|
Bergquist |
标准封装
|
TLB SA1000 30CC CARTRIDGE | |
|
2166081
PDF
|
Bergquist |
标准封装
|
TGF 1000 1200CC KIT | |
|
2167394
PDF
|
Bergquist |
标准封装
|
TGF 1500 400CC DUAL CARTRIDGE | |
|
2193537
PDF
|
Bergquist |
标准封装
|
TGF 4000 6 GALLON KIT | |
|
2167438
PDF
|
Bergquist |
标准封装
|
TGF 1000SR 1200CC KIT | |
|
2195752
PDF
|
Bergquist |
标准封装
|
TLF LF3500 4.33 GALLON PAIL | |
|
2179533
PDF
|
Bergquist |
标准封装
|
TGF 1100SF 50CC DUAL CARTRIDGE | |
|
860-5GPSW
PDF
|
MG Chemicals |
标准封装
|
SILICONE HEAT TRANSFER FLUID | |
|
PK223DM-110-KIT
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
TWO-PART THERMAL LIQUID GAP FILL | |
|
H-PUTTY-100-KIT
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
THERMAL PUTTY 100G PLUS APPLICAT | |
|
G3380T-130
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
THERMAL GREASE, TC=6.0W, 50ML CA | |
|
H-PUTTY2-100-KIT
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
THERMAL PUTTY 100G PLUS APPLICAT | |
|
TH855-5-75cc-syr
PDF
|
Penchem Technologies Sdn Bhd |
标准封装
|
Silicone Thermal Putty | |
| European Thermodynamics Ltd |
标准封装
|
THERMAL GREASE, 4.5W/M K, 1KG | ||
|
TH930-500G-JAR
PDF
|
Penchem Technologies Sdn Bhd |
标准封装
|
SILICONE THERMAL PUTTY | |
| Dycotec Materials Ltd |
标准封装
|
NON-SILICONE GEL/PUTTY 5.5 W/MK | ||
|
1188134
PDF
|
LOCTITE |
标准封装
|
STYCAST 2850KT BLU 3LB | |
|
A16872-03
PDF
|
Laird Technologies - Thermal Materials |
标准封装
|
TPUTTY 403 180CC CARTRIDGE | |
|
TH833-3_0.5_0.5
PDF
|
Penchem Technologies Sdn Bhd |
标准封装
|
Silicone thermal conductive pott | |
| Dycotec Materials Ltd |
标准封装
|
NON-SILICONE THERMAL PUTTY 8.5 W | ||
|
DM-TIM-15323-SYP
PDF
|
Dycotec Materials Ltd |
标准封装
|
ONE PART THERMAL EPOXY 2.3 W/MK | |
|
TC2-20G
PDF
|
Chip Quik Inc. |
标准封装
|
HEAT SINK COMPOUND - GREY ULTRA | |
|
A17262-01
PDF
|
Laird Technologies - Thermal Materials |
标准封装
|
TFLEX CR607 CARTRIDGE 50CC,EFD S | |
|
8618-3ML
PDF
|
MG Chemicals |
标准封装
|
ULTRA THERMAL PASTE, 6 W/M.K | |
| Parker Chomerics |
标准封装
|
THERM-A-GAP GEL 40NS 4.0 W/M-K D | ||
|
8327GF41-50CC
PDF
|
MG Chemicals |
标准封装
|
THERMAL GAP FILL LIQUID SILICONE | |
|
ACTCP00081A
PDF
|
ARCTIC |
标准封装
|
Arctic MX-6 - Waermeleitpaste - |