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粘合剂，环氧树脂，油脂，膏 芯片选型指南与应用电路参考
本专区收录了 628 款主流 粘合剂，环氧树脂，油脂，膏 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图（Pinout）、工作温度范围等电气参数，支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
|
2167257
PDF
|
Bergquist |
标准封装
|
TGF 1000SR 10 GALLON KIT | |
|
2698031
PDF
|
Bergquist |
标准封装
|
TGF 7000 400CC DUAL CARTRIDGE | |
|
2192336
PDF
|
Bergquist |
标准封装
|
TGF 2000 10 GALLON KIT | |
|
2168021
PDF
|
Bergquist |
标准封装
|
TGF 3600 400CC DUAL CARTRIDGE | |
|
2190034
PDF
|
Bergquist |
标准封装
|
TGF 1000 50CC DUAL CARTRIDGE | |
|
2166328
PDF
|
Bergquist |
标准封装
|
TGF 1000 10 GALLON KIT | |
|
2191802
PDF
|
Bergquist |
标准封装
|
TLF LF2000 600CC CARTRIDGE | |
|
2197935
PDF
|
Bergquist |
标准封装
|
TGF 3500LVO 400CC DUAL CARTRIDGE | |
|
SILVGREASE1
PDF
|
StarTech.com |
标准封装
|
THERMAL CPU PASTE COMPOUND | |
|
G3380A-110
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
THERMAL GREASE, TC=1.3W, 50ML CA | |
| Dycotec Materials Ltd |
标准封装
|
Non-silicone, PCM 1.75 W/mK | ||
|
CT40-5
PDF
|
Chemtronics |
标准封装
|
SILICONE GREASE 5 0Z TUBE | |
|
N-PUTTY-100-KIT
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
NON-SILICONE THERMAL PUTTY 100G | |
|
GCS-NSP30-100ML
PDF
|
European Thermodynamics Ltd |
标准封装
|
NON SIL PUTTY, 3.0W/MK, 100ML | |
|
H-PUTTY-950
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
THERMAL PUTTY 950G, BLUE COLOR, | |
| Dycotec Materials Ltd |
标准封装
|
Non-silicone, PCM 3.3 W/mK | ||
| Dycotec Materials Ltd |
标准封装
|
NON-SILICONE GEL/PUTTY 6.5 W/MK | ||
|
G3380NA-120
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
NON-SILICONE THERMAL GREASE, 120 | |
|
PK404DM-150
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
TWO-PART THERMAL LIQUID GAP FILL | |
|
127-20-10
PDF
|
Wakefield-Vette |
标准封装
|
GREASE 1GRAM SYRINGE 20W/M-K NON | |
|
GCS-NSP75 - 50ML
PDF
|
European Thermodynamics Ltd |
标准封装
|
NON SIL PUTTY, 7.5 W/M K, 50ML | |
|
X-PUTTY-100-KIT
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
THERMAL PUTTY 100G PLUS APPLICAT | |
|
PT366_0.5_0.25
PDF
|
Penchem Technologies Sdn Bhd |
标准封装
|
Black potting epoxy (2-parts) | |
|
TH855-5-50G-2JAR
PDF
|
Penchem Technologies Sdn Bhd |
标准封装
|
SILICONE THERMAL PUTTY (2 PACKS) | |
| Dycotec Materials Ltd |
标准封装
|
NON-SILICONE GEL/PUTTY 2.5 W/MK | ||
|
NL-PUTTY04-75
PDF
|
Shiu Li Technology Co., Ltd. |
标准封装
|
NON-SILICONE LIGHTWEIGHT THMERMA | |
|
TC2-10G
PDF
|
Chip Quik Inc. |
标准封装
|
HEAT SINK COMPOUND - GREY ULTRA | |
|
TC4-5G
PDF
|
Chip Quik Inc. |
标准封装
|
HEAT SINK THERMAL COMPOUND - DEE | |
|
1188124
PDF
|
LOCTITE |
标准封装
|
STYCAST 2850FT BLU 3# INDIVIDUAL | |
|
TC4-1G
PDF
|
Chip Quik Inc. |
标准封装
|
HEAT SINK THERMAL COMPOUND - DEE |
