FERRITE BEAD 80 OHM 0805 4LN
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铁氧体磁珠和芯片 芯片选型指南与应用电路参考
本专区收录了 7,215 款主流 铁氧体磁珠和芯片 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图(Pinout)、工作温度范围等电气参数,支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
|
MMZ2012D800BT000
PDF
|
TDK Corporation |
标准封装
|
FERRITE BEAD 80 OHM 0805 4LN | |
|
MMZ2012Y152BT000
PDF
|
TDK Corporation |
标准封装
|
FERRITE BEAD 1.5 KOHM 0805 1LN | |
|
MFBW1V2012-221-R
PDF
|
Eaton - Electronics Division |
标准封装
|
FERRITE BEAD 220 OHM 0805 1LN | |
|
BKP1608HS271-T
PDF
|
Taiyo Yuden |
标准封装
|
FERRITE BEAD 270 OHM 0603 4LN | |
|
BK1608LL681-T
PDF
|
Taiyo Yuden |
标准封装
|
FERRITE BEAD 680 OHM 0603 1LN | |
| Pulse Electronics |
标准封装
|
FERRITE BEAD 1.8 KOHM 0402 1LN | ||
|
2518065008Y6
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2512061028Y1
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2508056008Z0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2508053008Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2508051028Y1
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2506036008Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2506031218Y2
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2506030707H0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD 7 OHM 0603 1LN | |
|
2952778301
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD 315 OHM 8THD 1LN | |
|
2761007111
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD 111 OHM AXIAL 1LN | |
|
2744555566
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD 414 OHM 2SMD 1LN | |
|
2518127006Y3
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2512067006Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2512063016Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2508055006Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2508051216Z0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2506036016Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2506031216Z0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2504023016Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2743019446
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD 53 OHM 2SMD 1LN | |
|
BLM31KN601SH1K
PDF
|
Murata Electronics |
标准封装
|
FERRITE BEAD 600 OHM 1206 1LN | |
|
BLM31KN102SZ1K
PDF
|
Murata Electronics |
标准封装
|
FERRITE BEAD 1 KOHM 1206 1LN | |
|
CIM21U102NC
PDF
|
Samsung Electro-Mechanics |
标准封装
|
FERRITE BEAD 1000 OHM 0805 | |
|
CIC31J121NE
PDF
|
Samsung Electro-Mechanics |
标准封装
|
FERRITE BEAD 120 OHM 1206 1LN |