FERRITE BEAD 180 OHM 0402 1LN
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铁氧体磁珠和芯片 芯片选型指南与应用电路参考
本专区收录了 7,215 款主流 铁氧体磁珠和芯片 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图(Pinout)、工作温度范围等电气参数,支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
|
1-2176742-9
PDF
|
TE Connectivity Passive Product |
标准封装
|
FERRITE BEAD 180 OHM 0402 1LN | |
|
CIC21P300NE
PDF
|
Samsung Electro-Mechanics |
标准封装
|
FERRITE BEAD 30 OHM 0805 1LN | |
|
CIS21J121NE
PDF
|
Samsung Electro-Mechanics |
标准封装
|
FERRITE BEAD 120 OHM 0805 1LN | |
|
MMZ2012Y202BT000
PDF
|
TDK Corporation |
标准封装
|
FERRITE BEAD 2 KOHM 0805 1LN | |
|
MFBM1V2012-121-R
PDF
|
Eaton - Electronics Division |
标准封装
|
FERRITE BEAD 120 OHM 0805 1LN | |
|
MFBW1V1608-152-R
PDF
|
Eaton - Electronics Division |
标准封装
|
FERRITE BEAD 1.5 KOHM 0603 1LN | |
|
BK1608LM152-T
PDF
|
Taiyo Yuden |
标准封装
|
FERRITE BEAD 1.5 KOHM 0603 1LN | |
|
2512063018Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2508056018Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2508053008Y3
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2508051108Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2506036008Y3
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2506031218Z0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2506030708H0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2773009111
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD 182 OHM AXIAL 1LN | |
|
2761008111
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD 163 OHM AXIAL 1LN | |
|
2512067006Y3
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2512061026Y1
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2508056006Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2508051526Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2506038006Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2506031516Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
2504026006Y0
PDF
|
Fair-Rite Products Corp. |
标准封装
|
FERRITE BEAD MULT LAYER CHIP | |
|
BLM31KN601SN1K
PDF
|
Murata Electronics |
标准封装
|
FERRITE BEAD 600 OHM 1206 1LN | |
|
BLM31KN121SH1K
PDF
|
Murata Electronics |
标准封装
|
FERRITE BEAD 120 OHM 1206 1LN | |
|
CIC21J301NE
PDF
|
Samsung Electro-Mechanics |
标准封装
|
FERRITE BEAD 300 OHM 0805 1LN | |
|
CIC05P121NC
PDF
|
Samsung Electro-Mechanics |
标准封装
|
FERRITE BEAD 120 OHM 0402 1LN | |
|
BKP0603TM330-T
PDF
|
Taiyo Yuden |
标准封装
|
FERRITE BEAD 33 OHM 0201 1LN | |
|
BK20104S601-T
PDF
|
Taiyo Yuden |
标准封装
|
FERRITE BEAD 600 OHM 0804 1LN | |
|
BK0402HS121-T
PDF
|
Taiyo Yuden |
标准封装
|
FERRITE BEAD 120 OHM 01005 1LN |