HEATSINK TO-220 W/SHURLOCK-CLIP
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散热器 芯片选型指南与应用电路参考
本专区收录了 114,818 款主流 散热器 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图(Pinout)、工作温度范围等电气参数,支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
|
534202B02853G
PDF
|
Boyd Laconia, LLC |
标准封装
|
HEATSINK TO-220 W/SHURLOCK-CLIP | |
|
C247-025-1AE
PDF
|
Ohmite |
标准封装
|
HEATSINK FOR TO-247 WITH 1 CLIP | |
|
WC-T2X-38E
PDF
|
Ohmite |
标准封装
|
CERAMIC HEATSINK WITH CLIP | |
| Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 20X20X25MM | ||
|
C40-058-AE
PDF
|
Ohmite |
标准封装
|
HEATSINK FOR TO-247 TO-264 | |
|
ATS-54170D-C1-R0
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEAT SINK 17MM X 17MM X 9.5MM | |
|
551002B00000G
PDF
|
Boyd Laconia, LLC |
标准封装
|
HEATSINK TO-220 1.45" HIGH | |
|
575102B00000G
PDF
|
Boyd Laconia, LLC |
标准封装
|
HEATSINK TO-220 CLIP-ON BLK | |
|
HSE-B18254-0396H
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
HEAT SINK, EXTRUSION,TO-218, 25. | |
|
ATS-PCB1050
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK TO-220 W/TAB BLACK | |
|
V6560K
PDF
|
Assmann WSW Components |
标准封装
|
HEATSINK ALUM ANOD | |
|
FIT0506
PDF
|
DFRobot |
标准封装
|
PURE COPPER HEATSINK PACK OF 5 ( | |
| Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 54X54X25MM XCUT CP | ||
|
D10850-40
PDF
|
Wakefield-Vette |
标准封装
|
HEATSINK 128PQFP COMPOSITE | |
|
ATS-PCB1029
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK TO-220 BLACK | |
|
HSB25-282810
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
HEAT SINK, BGA, 28.5 X 28.5 X 10 | |
|
V2278E1
PDF
|
Assmann WSW Components |
标准封装
|
CPU HEATSINK, CROSS CUT, AL6063, | |
|
658-35ABT4E
PDF
|
Wakefield-Vette |
标准封装
|
HEATSINK CPU 28MM SQ BLK W/TAPE | |
|
657-15ABPEN
PDF
|
Wakefield-Vette |
标准封装
|
HEATSINK TO-220 W/PINS BLK 1.5" | |
|
HSB36-353510
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
HEAT SINK, BGA, 35 X 35 X 10 MM, | |
|
HSE04-251265-1
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
HEAT SINK, EXTRUSION, TO-218/TO- | |
|
M47079B011000G
PDF
|
Boyd Laconia, LLC |
标准封装
|
MAX CLIP HEATSINK | |
|
374424B00035G
PDF
|
Boyd Laconia, LLC |
标准封装
|
HEATSINK BGA W/ADHESIVE TAPE | |
|
271-AB
PDF
|
Wakefield-Vette |
标准封装
|
HEATSINK TO-220 TOP MNT BLK | |
|
273-AB
PDF
|
Wakefield-Vette |
标准封装
|
HEATSINK TO-220 LOW HEIGHT BLK | |
|
7-345-2PP-BA
PDF
|
CTS Thermal Management Products |
标准封装
|
HEATSINK PWR DUAL BLACK TO-220 | |
|
528-45AB
PDF
|
Wakefield-Vette |
标准封装
|
HEATSINK DC/DC HALF BRICK VERT | |
| Same Sky (Formerly CUI Devices) |
标准封装
|
HEAT SINK, EXTRUSION, TO-220, 38 | ||
|
ATS-PCB1009
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK TO-220 LOW PROFILE | |
|
ATS-PCB1019
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK TO-218/TO-202/TO-220 |