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散热器 芯片选型指南与应用电路参考
本专区收录了 114,818 款主流 散热器 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图（Pinout）、工作温度范围等电气参数，支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
|
125392
PDF
|
Wakefield-Vette |
标准封装
|
5WX36" EXTRUSION 19589 XX7331 | |
|
ATS-EXL7-1220-R0
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK AL6063 1220X101X14MM | |
|
127733
PDF
|
Wakefield-Vette |
标准封装
|
5.64" WIDE X 12" MULTI CHANNEL 7 | |
| Advanced Thermal Solutions Inc. |
标准封装
|
STR FIN 30.25X30.25X14.5MM T766 | ||
|
680-75A
PDF
|
Wakefield-Vette |
标准封装
|
HEATSINK TO-220 OMNIDIRECT BLK | |
| iWave Global |
标准封装
|
I.MX 8M PLUS SMARC SOM HEATSINK | ||
| Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 45X45X6MM | ||
|
ATS-59001-C1-R0
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEAT SINK 28MM X 45MM X 11MM | |
|
HSF-55-33-Y-F
PDF
|
Wakefield-Vette |
标准封装
|
FANSINK 12VDC 55X55X33.1MM | |
| iWave Global |
标准封装
|
ZU+ZU7/ZU5/ZU4 MPSOC SOM FANSINK | ||
| Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 45X45X10MM XCUT FP | ||
| Malico Inc. |
标准封装
|
AL HEAT SINK 35X35X20MM | ||
| iWave Global |
标准封装
|
i.MX 8MMini SODIMM Heat Spreader | ||
|
ATS-61700K-C2-R0
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
FANSINK ASSEMBLY W/ MOUNTING HAR | |
|
CS8673020B0
PDF
|
Cooling Source |
标准封装
|
30X30X20MM | |
| Advanced Thermal Solutions Inc. |
标准封装
|
HEAT SINK FOR TI MOD #TAS5611PHD | ||
|
ATS-06D-12-C2-R0
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 50X50X12.7MM XCUT T766 | |
|
ATS-P2-15-C2-R0
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 50X50X25MM XCUT T766 | |
|
ATS-1041-C2-R0
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 41X45X10MM BRASSPUSHPIN | |
|
ATS-51375K-C1-R0
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEAT SINK 37.5 X 37.5 X 14.5MM | |
|
ATS-08B-26-C2-R0
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 70X70X10MM XCUT T766 | |
| Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 70X70X10MM XCUT T766 | ||
|
ATS-16C-35-C2-R0
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 36.83X57.6X5.84MM T766 | |
|
ATS-50330G-C1-R0
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEAT SINK 33MM X 33MM X 12.5MM | |
| Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 70X70X25MM XCUT T766 | ||
| Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 25X25X25MM R-TAB CP | ||
| Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 45X45X10MM L-TAB FP | ||
|
ATS-PCB1070
PDF
|
Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK TO-220 BLACK | |
| Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 45X45X10MM XCUT CP | ||
| Advanced Thermal Solutions Inc. |
标准封装
|
HEATSINK 25X25X35MM L-TAB FP |
