RFI FINGERSTOCK SS GOLD SOLDER
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RFI 和 EMI - 触头,簧片和衬垫 芯片选型指南与应用电路参考
本专区收录了 3,985 款主流 RFI 和 EMI - 触头,簧片和衬垫 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图(Pinout)、工作温度范围等电气参数,支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
| Amphenol ICC (FCI) |
标准封装
|
RFI FINGERSTOCK SS GOLD SOLDER | ||
|
S7111-42R
PDF
|
Harwin Inc. |
标准封装
|
RFI SHLD FINGER CU GOLD SOLDER | |
|
S1951-46R
PDF
|
Harwin Inc. |
标准封装
|
RFI SHLD FINGER BECU TIN SOLDER | |
|
2343297-2
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
RFI SHLD FINGER GOLD CLIP | |
|
07-0201-0875
PDF
|
Parker Chomerics |
标准封装
|
RFI GASKET MON ALLOY | |
|
Z003-007L1-11001
PDF
|
Amphenol ICC (FCI) |
标准封装
|
RFI FINGERSTOCK PHOS GOLD SOLDER | |
|
77-12-3108-02400
PDF
|
Parker Chomerics |
标准封装
|
RFI FOF GASKET NI/CU ADH | |
| Parker Chomerics |
标准封装
|
RFI GASKET ELASTOMER NICKEL FOOT | ||
| Laird Technologies EMI |
标准封装
|
RFI FILM OVER FOAM PU SOLDER | ||
|
10-04-6386-6502
PDF
|
Parker Chomerics |
标准封装
|
RFI GASKET ELASTOMER NICKEL FOOT | |
|
77-12-3270-02400
PDF
|
Parker Chomerics |
标准封装
|
RFI FOF GASKET NI/CU ADH | |
|
BMI-C-004
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FINGERSTOCK BECU GOLD SOLDER | |
|
4570PA01H01800
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FOF GASKET PU ADH | |
|
S1961-46R
PDF
|
Harwin Inc. |
标准封装
|
RFI SHD FINGER CUPRO NIC TIN SLD | |
|
2040852-1
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
RFI SHLD FINGER CU GOLD SOLDER | |
|
S7171-45R
PDF
|
Harwin Inc. |
标准封装
|
RFI SHLD FINGER PHOS GOLD SOLDER | |
|
3-2199250-5
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
RFI SHLD FINGER CU GOLD SOLDER | |
|
10-04-8817-6502
PDF
|
Parker Chomerics |
标准封装
|
RFI GASKET ELASTOMER NICKEL FOOT | |
|
0D97098317
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FINGERSTOCK BECU TIN CLIP | |
|
1551631-5
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
RFI SHLD FINGER SS GOLD SOLDER | |
|
2108610-5
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
RFI SHLD FINGER CU GOLD SOLDER | |
| Laird Technologies EMI |
标准封装
|
RFI FILM OVER FOAM PU SOLDER | ||
|
0097053802
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FINGERSTOCK BECU ADH | |
|
4695PA51H01800
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FOF GASKET PU ADH | |
|
8102020240
PDF
|
Laird Technologies EMI |
标准封装
|
RFI GASKET BECU ADH FOOT | |
|
1201-SSA-0018
PDF
|
TE Kemtron |
标准封装
|
RFI GASKET SIL SILVER | |
|
8863-0184-89
PDF
|
Laird Technologies EMI |
标准封装
|
RFI EMI SHIELD MATERIAL FOOT | |
|
4633PA51H01800
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FOF GASKET PU ADH | |
|
8863-0186-81
PDF
|
Laird Technologies EMI |
标准封装
|
OSTRSD,ECE081 FOOT | |
|
77-12-3844-02400
PDF
|
Parker Chomerics |
标准封装
|
RFI FOF GASKET NI/CU ADH |