RFI FOF GASKET NI/CU ADH
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RFI 和 EMI - 触头，簧片和衬垫 芯片选型指南与应用电路参考
本专区收录了 3,985 款主流 RFI 和 EMI - 触头，簧片和衬垫 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图（Pinout）、工作温度范围等电气参数，支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
|
77-12-3607-02400
PDF
|
Parker Chomerics |
标准封装
|
RFI FOF GASKET NI/CU ADH | |
|
120220-0312
PDF
|
ITT Cannon, LLC |
标准封装
|
RFI SHD FINGER TITAN CU NICK SLD | |
|
4164EE51K00132
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FOF GASKET PU | |
| TE Kemtron |
标准封装
|
RFI GASKET SIL NICKEL | ||
|
21B03-BFA000543N
PDF
|
Orbel Corporation |
标准封装
|
RFI FINGERSTOCK UNPLATED SLOT | |
|
19-04-22951-6502
PDF
|
Parker Chomerics |
标准封装
|
RFI GASKET ELASTOMER NICKEL FOOT | |
|
4206PA51G01800
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FOF GASKET ADH | |
|
Z02H-4F7L1-11000
PDF
|
Amphenol ICC (FCI) |
标准封装
|
RFI FINGERSTOCK PHOS GOLD SOLDER | |
|
2108612-5
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
RFI SHLD FINGER CU GOLD SOLDER | |
|
2199248-5
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
RFI SHLD FINGER SS GOLD SOLDER | |
|
1437259-6
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
RFI SHLD FINGER CU NICKEL SOLDER | |
|
0097061102
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FINGERSTOCK BECU CLIP | |
| Parker Chomerics |
标准封装
|
RFI COND FOAM URATHANE PSA | ||
|
1447360-8
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
RFI SHLD FINGER CU GOLD SOLDER | |
|
S1711-46R
PDF
|
Harwin Inc. |
标准封装
|
RFI SHLD CLIP SS TIN SOLDER | |
| Amphenol ICC (FCI) |
标准封装
|
RFI FINGERSTOCK SS GOLD SOLDER | ||
|
1054390004
PDF
|
Molex |
标准封装
|
RFI SHLD FINGER SS GOLD SOLDER | |
|
BMI-C-007-01
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FINGERSTOCK BECU TIN SOLDER | |
|
0077004302
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FINGERSTOCK BECU NICKEL ADH | |
|
77-12-3175-02400
PDF
|
Parker Chomerics |
标准封装
|
RFI FOF GASKET NI/CU ADH | |
|
120220-0202
PDF
|
ITT Cannon, LLC |
标准封装
|
RFI SHLD FINGER BECU NICK SOLDER | |
|
3224-0001
PDF
|
I-PEX |
标准封装
|
MP-A04 EMI CLIP 1.37MM OD COAX | |
|
3182-0001
PDF
|
I-PEX |
标准封装
|
MP-A02 EMI CLIP 1.13MM OD COAX | |
|
4078PA51H01800
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FOF GASKET PU ADH | |
|
TC-01-MINI
PDF
|
Leader Tech Inc. |
标准封装
|
RFI SHLD CLIP PHOS TIN SOLDER | |
|
LT18CJ4430
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FINGERSTOCK BECU TIN SLOT | |
| Laird Technologies EMI |
标准封装
|
RFI FINGERSTOCK BECU GOLD SOLDER | ||
|
4228PA51H01800
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FOF GASKET PU ADH | |
| Parker Chomerics |
标准封装
|
RFI COND FOAM URATHANE PSA | ||
|
S0941-46R
PDF
|
Harwin Inc. |
标准封装
|
RFI SHLD CLIP SS TIN SOLDER |
