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RFI 和 EMI - 触头，簧片和衬垫 芯片选型指南与应用电路参考
本专区收录了 3,985 款主流 RFI 和 EMI - 触头，簧片和衬垫 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图（Pinout）、工作温度范围等电气参数，支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
|
S1981-46R
PDF
|
Harwin Inc. |
标准封装
|
RFI SHD FINGER CUPRO NIC TIN SLD | |
|
4242PA51H01800
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FOF GASKET PU ADH | |
| TE Kemtron |
标准封装
|
RFI GASKET SIL NICKEL | ||
|
8866-9140-89
PDF
|
Laird Technologies EMI |
标准封装
|
DSTRHOL,ECE089,PSA FOOT | |
|
82-55906
PDF
|
Parker Chomerics |
标准封装
|
RFI SHLD MAT ELASTOMER | |
|
4694AB51K09600
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FOF GASKET PU | |
|
93-22036
PDF
|
TE Kemtron |
标准封装
|
RFI GASKET FSA | |
|
4797PA22101800
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FOF GASKET ADH | |
|
100D300-024000
PDF
|
Orbel Corporation |
标准封装
|
RFI FOF GASKET CU NICKEL ADH | |
|
77-12-3807-02400
PDF
|
Parker Chomerics |
标准封装
|
RFI FOF GASKET NI/CU ADH | |
|
0077006102
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FINGERSTOCK BECU SLOT | |
|
060D150-024000
PDF
|
Orbel Corporation |
标准封装
|
RFI FOF GASKET CU NICKEL ADH | |
|
120220-0210
PDF
|
ITT Cannon, LLC |
标准封装
|
RFI SHLD FINGER BECU NICK SOLDER | |
|
77-12-3298-02400
PDF
|
Parker Chomerics |
标准封装
|
RFI FOF GASKET NI/CU ADH | |
| TE Kemtron |
标准封装
|
RFI GASKET FNG NICKEL | ||
|
10-04-2865-6502
PDF
|
Parker Chomerics |
标准封装
|
RFI GASKET ELASTOMER NICKEL FOOT | |
|
4206PA51H01800
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FOF GASKET PU ADH | |
|
SG060125R-48
PDF
|
Leader Tech Inc. |
标准封装
|
RFI FOF GASKET PU ADH | |
|
2108693-4
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
RFI SHLD FINGER CU GOLD SOLDER | |
|
2199001-1
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
RFI SHLD FINGER GOLD SOLDER | |
|
2199249-3
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
RFI SHLD FINGER PHOS GOLD SOLDER | |
|
1734300-1
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
RFI SHLD FINGER TITAN CU AU SLDR | |
|
S7061-42R
PDF
|
Harwin Inc. |
标准封装
|
RFI SHLD FINGER CU GOLD SOLDER | |
|
0097055017
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FINGERSTOCK BECU TIN ADH | |
|
0097022102
PDF
|
Laird Technologies EMI |
标准封装
|
FINGERSTOCK BECU 3.18X304.8MM | |
| Parker Chomerics |
标准封装
|
RFI COND FOAM URATHANE PSA | ||
|
S7271-45R
PDF
|
Harwin Inc. |
标准封装
|
RFI SHLD FINGER CU GOLD SOLDER | |
|
4094PA51H01800
PDF
|
Laird Technologies EMI |
标准封装
|
RFI FOF GASKET PU ADH | |
|
2108609-5
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
RFI SHLD FINGER CU GOLD SOLDER | |
| Laird Technologies EMI |
标准封装
|
RFI FINGERSTOCK BECU GOLD SOLDER |
