IC OP AMP AUTO-ZERO SGL 10VSSOP
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传感器和检测器接口 芯片选型指南与应用电路参考
本专区收录了 1,269 款主流 传感器和检测器接口 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图（Pinout）、工作温度范围等电气参数，支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
|
PGA308AQDGSRQ1
PDF
|
Texas Instruments |
标准封装
|
IC OP AMP AUTO-ZERO SGL 10VSSOP | |
|
ZSSC3281BC5B
PDF
|
Renesas Electronics Corporation |
标准封装
|
DICE ON 304 MICRO METER WAFER WI | |
|
UZZ9001,118
PDF
|
NXP USA Inc. |
标准封装
|
IC SENSOR COND DUAL 24SO | |
|
ZSSC3240CI3R
PDF
|
Renesas Electronics Corporation |
标准封装
|
IC SENSOR SIGNAL COND 24VFQFPN | |
|
ZSSC3240CI2B
PDF
|
Renesas Electronics Corporation |
标准封装
|
IC SENSOR SIGNAL CONDITIONER | |
|
MAX32664GWEC+
PDF
|
Analog Devices Inc./Maxim Integrated |
标准封装
|
SENSOR HUB W/ SPO2 & HR ALGORITH | |
|
MAX32664GWED+
PDF
|
Analog Devices Inc./Maxim Integrated |
标准封装
|
SENSOR HUB W/ SPO2, HR & BP ALGO | |
|
ZSSC3281BC3R
PDF
|
Renesas Electronics Corporation |
标准封装
|
RESISTIVE 2-CHANNEL SENSOR SIGNA | |
|
MAX31913AUI+T
PDF
|
Analog Devices Inc./Maxim Integrated |
标准封装
|
IC TXRX OCTAL DIGITAL INP TSSOP | |
|
MAX22192ARC+T
PDF
|
Analog Devices Inc./Maxim Integrated |
标准封装
|
ISOLATED INDUSTRIAL DGTL INPUT W | |
|
ZSSC4151AE1C
PDF
|
Renesas Electronics Corporation |
标准封装
|
DICE (WAFER SAWN) - FRAME | |
|
A5367CA-T
PDF
|
Allegro MicroSystems |
标准封装
|
IC SMOKE DETECTOR ION 16DIP | |
|
AD22050RZ-REEL7
PDF
|
Analog Devices Inc. |
标准封装
|
IC AMP DIFF SINGLE SUPPLY 8SOIC | |
|
AD22050RZ-REEL
PDF
|
Analog Devices Inc. |
标准封装
|
IC AMP DIFF SINGLE SUPPLY 8SOIC | |
|
CS4121ENF16
PDF
|
onsemi |
标准封装
|
IC TACH/SPEEDO DRIVER 16-DIP | |
|
ZSSC3138BA1B
PDF
|
Renesas Electronics Corporation |
标准封装
|
WAFER (UNSAWN) - BOX | |
|
MAX31850EATB+T
PDF
|
Analog Devices Inc./Maxim Integrated |
标准封装
|
IC CONV THRMCPLE-DIG E TYPE TDFN | |
|
ZSC31050FAB
PDF
|
Renesas Electronics Corporation |
标准封装
|
WAFER (UNSAWN) - BOX | |
|
SX8724CWLTDT
PDF
|
Semtech Corporation |
标准封装
|
IC DAS ADC 16BIT 12-MLPQ | |
|
ZSSC3230BI1DES
PDF
|
Renesas Electronics Corporation |
标准封装
|
DICE (WAFER SAWN) - WAFFLE PACK | |
|
RE46C108S8F
PDF
|
Microchip Technology |
标准封装
|
IC HORN DRIVER DUAL 8SOIC | |
|
MC145010EGR2
PDF
|
NXP USA Inc. |
标准封装
|
IC SMOKE DETECT PHOTOELEC 16SOIC | |
|
MCZ145012EGR2
PDF
|
NXP USA Inc. |
标准封装
|
IC SMOKE DETECT PHOTOELEC 16SOIC | |
|
ZSSC3241DL5C
PDF
|
Renesas Electronics Corporation |
标准封装
|
WAFER (SAWN) - FRAME | |
|
ZSSC3018BA2B
PDF
|
Renesas Electronics Corporation |
标准封装
|
WAFER (UNSAWN) - BOX | |
|
ZSSC4161DE1B-APB
PDF
|
Renesas Electronics Corporation |
标准封装
|
TESTED WAFER -CFG 4161_0500_03 V | |
|
ZSSC3230BC5B
PDF
|
Renesas Electronics Corporation |
标准封装
|
WAFER UNSAWN, 304U, WITH INKING | |
|
ZSSC3281BI2B
PDF
|
Renesas Electronics Corporation |
标准封装
|
DICE ON 725 MICRO METER WAFER NO | |
|
MAX9621AUB+T
PDF
|
Analog Devices Inc./Maxim Integrated |
标准封装
|
IC HALL EFFECT SENSOR 10UMAX | |
|
TDC-GP30YD 3K
PDF
|
ScioSense |
标准封装
|
IC CONVERTER SPI UART 32QFN |
