IC CCD SIGNAL PROCESSOR 32-LFCSP
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传感器和检测器接口 芯片选型指南与应用电路参考
本专区收录了 1,269 款主流 传感器和检测器接口 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图（Pinout）、工作温度范围等电气参数，支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
|
AD9945KCPRL
PDF
|
Analog Devices Inc. |
标准封装
|
IC CCD SIGNAL PROCESSOR 32-LFCSP | |
|
AD9843AJST
PDF
|
Analog Devices Inc. |
标准封装
|
IC CCD SIGNAL PROC 10BIT 48-LQFP | |
|
AD9841AJSTRL
PDF
|
Analog Devices Inc. |
标准封装
|
IC CCD SIGNAL PROC 10BIT 48-LQFP | |
|
AD22050N
PDF
|
Analog Devices Inc. |
标准封装
|
IC AMP DIFF SNGL-SUP 8DIP | |
|
AD9891KBC
PDF
|
Analog Devices Inc. |
标准封装
|
IC CCD SIGNAL PROC/GEN 64-CSPBGA | |
|
AD9821KSTRL
PDF
|
Analog Devices Inc. |
标准封装
|
IC IMAGE SGNL PROC 12BIT 48-LQFP | |
|
PGA460TPW
PDF
|
Texas Instruments |
标准封装
|
ULTRASONIC SIGNAL PROCESSOR AND | |
|
ADPD4100BCBZR7
PDF
|
Analog Devices Inc. |
标准封装
|
OPTICAL AFE FOR WEARABLES-SPI | |
|
MAX9926UAEE+
PDF
|
Analog Devices Inc./Maxim Integrated |
标准封装
|
IC SENSOR INTERFACE VARI 16-QSOP | |
|
TDC7200PWR
PDF
|
Texas Instruments |
标准封装
|
IC DIG CONV 14TSSOP | |
|
XTR111AIDGQR
PDF
|
Texas Instruments |
标准封装
|
IC PREC VOLT-CURR CONV/TX 10MSOP | |
|
AD8497ARMZ-R7
PDF
|
Analog Devices Inc. |
标准封装
|
IC THERMOCOUPLE A W/COMP 8MSOP | |
|
MAX6682MUA+T
PDF
|
Analog Devices Inc./Maxim Integrated |
标准封装
|
IC THERMISTOR TO DGTL 8UMAX | |
|
PGA308AIDGSR
PDF
|
Texas Instruments |
标准封装
|
IC PROG SENSOR SGL COND 10-MSOP | |
| Renesas |
标准封装
|
RAA2S4263B5HWT#FF0 | ||
|
ZSSC3286BI8R
PDF
|
Renesas |
标准封装
|
ZSSC3286BI8R | |
|
MTCH9010-E/REB
PDF
|
Microchip Technology |
标准封装
|
LIQUID DETECTION DEVICE, CAPACIT | |
|
MTCH9010-I/REB
PDF
|
Microchip Technology |
标准封装
|
LIQUID DETECTION DEVICE, CAPACIT | |
|
RE46C305Q16T
PDF
|
Microchip Technology |
标准封装
|
HORN DRIVER FAULT DETECT | |
|
RE46C730IV28T
PDF
|
Microchip Technology |
标准封装
|
IND. PHOTO SMOKE WITH DEMOD & IS | |
|
AD9895KBCZRL
PDF
|
Analog Devices Inc. |
标准封装
|
IC CCD SIGNAL PROC/GEN 64CSBGA | |
|
PGA308TDD2
PDF
|
Texas Instruments |
标准封装
|
IC PROG SENSOR SGNL COND DIE | |
|
ZSSC3135BA1D
PDF
|
Renesas Electronics Corporation |
标准封装
|
DICE (WAFER SAWN) - WAFFLE PACK | |
|
TPIC8101DWRG4
PDF
|
Texas Instruments |
标准封装
|
IC KNOCK SENSOR INTERFACE 20SOIC | |
|
ZSSC3016CC1B
PDF
|
Renesas Electronics Corporation |
标准封装
|
WAFER (UNSAWN) - BOX | |
|
ZSC31015EAC
PDF
|
Renesas Electronics Corporation |
标准封装
|
DICE (WAFER SAWN) - FRAME | |
|
ZSC31014EAC
PDF
|
Renesas Electronics Corporation |
标准封装
|
DICE (WAFER SAWN) - FRAME | |
|
BU21077MUV-E2
PDF
|
Rohm Semiconductor |
标准封装
|
CAPACITIVE SWITCH CONTROLLER IC | |
|
PT8A2621PEX
PDF
|
Diodes Incorporated |
标准封装
|
PIR CONTROLLER DIP-16 | |
|
AS8002-AQFP
PDF
|
ams-OSRAM USA INC. |
标准封装
|
IC CURRENT MEASURE SOLAR 16VQFN |
