CONTACT SMD GOLD
重点方案领域直达:
⚡
触头,弹簧式和压力式 芯片选型指南与应用电路参考
本专区收录了 705 款主流 触头,弹簧式和压力式 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图(Pinout)、工作温度范围等电气参数,支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
|
S70-125161545R
PDF
|
Harwin Inc. |
标准封装
|
CONTACT SMD GOLD | |
| Mill-Max Manufacturing Corp. |
标准封装
|
7945 MODIFIED OMNIBALL PIN WITH | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
STANDARD SPRING LOADED PIN | ||
|
CPG-81-TH-B
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
POGO PIN, 6.477MM HEIGHT, THROUG | |
|
CPG-66-SMT-B
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
POGO PIN, 5.0MM HEIGHT, SURFACE | |
|
PH-MVS-5365-C1
PDF
|
Adam Tech |
标准封装
|
POGO PIN BRS GOLD SOLDER STR INT | |
| Adam Tech |
标准封装
|
POGO PIN BRS GOLD SMT STR INT=10 | ||
|
CPG-65-SMTB
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
POGO PIN, 2.4MM HEIGHT, SURFACE | |
|
CPG-55-SMT-B
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
POGO PIN, 4.5 HEIGHT, SURFACE M | |
| Mill-Max Manufacturing Corp. |
标准封装
|
SPRING-LOADED PIN WITH POINTED T | ||
|
CPG-38-TH-B
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
90 GF INITIAL OPERATING FORCE, 1 | |
|
CPG-36-TH-TR
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
67 GF INITIAL OPERATING FORCE, 7 | |
|
CPG-11-SMT-B
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
50 GF INITIAL OPERATING FORCE, 7 | |
|
CPG-37-TH-TR
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
28 GF INITIAL OPERATING FORCE, 3 | |
|
90194-AS
PDF
|
Preci-Dip |
标准封装
|
CONTACT SPRING LOADED SLDR CUP | |
| Mill-Max Manufacturing Corp. |
标准封装
|
DOUBLE ACTION SPRING-LOADED PIN | ||
|
90141-AS
PDF
|
Preci-Dip |
标准封装
|
CONTACT SPRING LOADED SLDR CUP | |
|
1857773-2
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
CONTACT SPRING LOADED SMD GOLD | |
| Omron Electronics Inc-EMC Div |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
| Omron Electronics Inc-EMC Div |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
| Omron Electronics Inc-EMC Div |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
| Omron Electronics Inc-EMC Div |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
STANDARD I.C. PIN | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
STANDARD I.C. PIN | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
STANDARD I.C. PIN | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
STANDARD I.C. PIN | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
STANDARD I.C. PIN | ||
|
P70-2410045R
PDF
|
Harwin Inc. |
标准封装
|
TH SPG LOADED POGO PIN 9.6MM | |
|
P70-2520045R
PDF
|
Harwin Inc. |
标准封装
|
SMTT SPG LOADED POGO PIN 3.9MM | |
|
H-1015-C
PDF
|
Altech Corporation |
标准封装
|
POGO PIN H-1015-C |