CONTACT SPRING LOADED SMD GOLD
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触头,弹簧式和压力式 芯片选型指南与应用电路参考
本专区收录了 705 款主流 触头,弹簧式和压力式 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图(Pinout)、工作温度范围等电气参数,支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
| Mill-Max Manufacturing Corp. |
标准封装
|
CONTACT SPRING LOADED SMD GOLD | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
CONTACT SPRING LOADED SMD GOLD | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
CONTACT SPRING LOADED SMD GOLD | ||
|
PH-MVS-5370-C1
PDF
|
Adam Tech |
标准封装
|
POGO PIN BRS GOLD SOLDER STR INT | |
| Mill-Max Manufacturing Corp. |
标准封装
|
.024" STROKE SPRING-LOADED PIN | ||
|
CPG-71-SMT-B
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
POGO PIN, 5.0MM HEIGHT, SURFACE | |
|
CPG-60-TH-B
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
POGO PIN, 5.21MM HEIGHT, THROUG | |
|
CPG-63-SMT-B
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
POGO PIN, 5.23 MM HEIGHT, SURFAC | |
|
CPG-64-SMT-B
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
POGO PIN, 2.7MM HEIGHT, SURFACE | |
|
CPG-20-SMT-B
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
70 GF INITIAL OPERATING FORCE, 8 | |
|
CPG-14-SMT-B
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
30 GF INITIAL OPERATING FORCE, 5 | |
|
CPG-10-SMT-B
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
50 GF INITIAL OPERATING FORCE, 7 | |
|
CPG-44-TH-TR
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
25 GF INITIAL OPERATING FORCE, 3 |