CONTACT SPRING LOADED T/H GOLD
重点方案领域直达:
⚡
触头,弹簧式和压力式 芯片选型指南与应用电路参考
本专区收录了 705 款主流 触头,弹簧式和压力式 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图(Pinout)、工作温度范围等电气参数,支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
| Omron Electronics Inc-EMC Div |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
STANDARD SPRING LOADED PIN | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
STANDARD SPRING LOADED PIN | ||
| Omron Electronics Inc-EMC Div |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
|
0908-1-CLIP
PDF
|
Preci-Dip |
标准封装
|
SPRING PIN CLIP DESIGN | |
| Mill-Max Manufacturing Corp. |
标准封装
|
STANDARD I.C. PIN | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
STANDARD I.C. PIN | ||
| Omron Electronics Inc-EMC Div |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
|
90773-AS
PDF
|
Preci-Dip |
标准封装
|
SPRING PIN CLIP DESIGN | |
|
P70-2550045R
PDF
|
Harwin Inc. |
标准封装
|
SMT SPG LOADED POGO PIN 9MM | |
|
P70-2540045R
PDF
|
Harwin Inc. |
标准封装
|
SMT SPG LOADED POGO PIN 8.25MM | |
| Mill-Max Manufacturing Corp. |
标准封装
|
STANDARD SPRING LOADED PIN | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
STANDARD SPRING LOADED PIN | ||
|
A-CSL-S-020-BR4
PDF
|
Assmann WSW Components |
标准封装
|
SPRING CONTACT, POGO-PIN, 1PIN | |
|
P1113CV3
PDF
|
Harwin Inc. |
标准封装
|
ONE PART SPRING PROBE, 3MM MINIM | |
|
90625-AS
PDF
|
Preci-Dip |
标准封装
|
SPRING PIN CLIP DESIGN | |
| Mill-Max Manufacturing Corp. |
标准封装
|
STANDARD I.C. PIN | ||
|
PH-MVF-3345
PDF
|
Adam Tech |
标准封装
|
CONTACT SPRING LOADED SMD GOLD | |
| Mill-Max Manufacturing Corp. |
标准封装
|
SURFACE MOUNT SPRING-LOADED PIN | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
|
0907-1-CLIP
PDF
|
Preci-Dip |
标准封装
|
CONTACT SPRING LOADED SMD GOLD I | |
| Mill-Max Manufacturing Corp. |
标准封装
|
CONTACT SPRING LOADED SMD GOLD | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
SPRING-LOADED PIN WITH RECEPTACL | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
CONTACT SPRING LOADED SMD GOLD | ||
|
CPG-05-N-B
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
POGOPIN, SOLID NEEDLE, 1.55MM HE | |
|
P1113SS3
PDF
|
Harwin Inc. |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | |
|
50341-20
PDF
|
Preci-Dip |
标准封装
|
.118" DIAMETER TARGET DISC THT | |
|
50370-1PN0
PDF
|
Preci-Dip |
标准封装
|
.053" DIAMETER TARGET DISC SMT | |
| Mill-Max Manufacturing Corp. |
标准封装
|
CONTACT SPRING LOADED SMD GOLD | ||
|
90224-AS
PDF
|
Preci-Dip |
标准封装
|
CONTACT SPRING LOADED T/H GOLD |