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触头,弹簧式和压力式 芯片选型指南与应用电路参考
本专区收录了 705 款主流 触头,弹簧式和压力式 电子元器件。涵盖详细工作电压/电流、封装尺寸、引脚分布图(Pinout)、工作温度范围等电气参数,支持按原厂型号精准比对、Pin-to-Pin 替代选型及最新原厂官方 Datasheet 规格书免费查阅与下载。
| 器件型号 (MPN) | 制造原厂 | 封装规格 | 电气特性与技术摘要 | 规格书 / 详情 |
|---|---|---|---|---|
|
90168-AS
PDF
|
Preci-Dip |
标准封装
|
CONTACT SPRING LOADED SLDR CUP | |
|
90101-AS
PDF
|
Preci-Dip |
标准封装
|
CONTACT SPRING LOADED SLDR CUP | |
| Omron Electronics Inc-EMC Div |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
SPRING-LOADED POWER PIN | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
| Omron Electronics Inc-EMC Div |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
| Omron Electronics Inc-EMC Div |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
|
90154-AS
PDF
|
Preci-Dip |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | |
| Mill-Max Manufacturing Corp. |
标准封装
|
STANDARD I.C. PIN | ||
| Omron Electronics Inc-EMC Div |
标准封装
|
CONTACT PROBE PIN .4MM PITCH | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
CONTACT SPRING LOADED SMD GOLD | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
CONTACT SPRING LOADED SMD GOLD | ||
| Altech Corporation |
标准封装
|
POGO PIN 5110/G-D-0.8NE-AU-2.3C | ||
|
90771-AS
PDF
|
Preci-Dip |
标准封装
|
SPRING PIN CLIP DESIGN | |
|
75015-1P0
PDF
|
Preci-Dip |
标准封装
|
.118" DIAMETER TARGET DISC SOLDE | |
|
1717380-1
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
SPRING PROBE CONN 1POS DROP-IN | |
|
2173352-1
PDF
|
TE Connectivity AMP Connectors |
标准封装
|
CONTACT SPRING LOADED | |
|
PH-MVP-5375
PDF
|
Adam Tech |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | |
| Mill-Max Manufacturing Corp. |
标准封装
|
CONN SPRING TARGET 1POS SMD | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
HORIZONTAL SURFACE MOUNT (HSMT) | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
HORIZONTAL SURFACE MOUNT (HSMT) | ||
| Mill-Max Manufacturing Corp. |
标准封装
|
SPRING LOADED PIN WITH SOLDERCUP | ||
|
52051-1P0
PDF
|
Preci-Dip |
标准封装
|
.148" DIAMETER TARGET DISC SMT | |
|
CPG-01-SMT-TR
PDF
|
Same Sky (Formerly CUI Devices) |
标准封装
|
POGOPIN, SMT, 4.20MM WORKING HEI | |
| Mill-Max Manufacturing Corp. |
标准封装
|
LOW PROFILE SMT SPRING-LOADED PI | ||
|
0907-3-CLIP
PDF
|
Preci-Dip |
标准封装
|
CONTACT SPRING LOADED SMD GOLD I | |
| Mill-Max Manufacturing Corp. |
标准封装
|
CONTACT SPRING LOADED SMD GOLD | ||
| Omron Electronics Inc-EMC Div |
标准封装
|
CONTACT SPRING LOADED T/H GOLD | ||
|
90234-AS
PDF
|
Preci-Dip |
标准封装
|
CONTACT SPRING LOADED SMD GOLD |